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Plastic lead frame high-speed tin plating equipment series

Plastic lead frame high-speed tin plating equipment series

According to customer requirements, the following equipment can be customized:
Customize processes according to product characteristics;
The SECS-GEM protocol can be built-in to facilitate access to the customer's production management system;
The maintenance reminder function can be configured to make equipment maintenance smarter;

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On-line inspection equipment for lead frames after stamping

On-line inspection equipment for lead frames after stamping

Online stamping/electroplating lead frame visual inspection machine is used for surface quality inspection of IC lead frames after stamping and electroplating. Inspection method: online inspection.

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Chip lead frame electrofilm development and silver plating equipment

Chip lead frame electrofilm development and silver plating equipment

This equipment is designed for special QFN or IC ultra-dense and ultra-fine electroplating areas that cannot be achieved with traditional electroplating molds. It is a specially developed special electroplating equipment that transfers sheet products through steel belts for electrofilming, exposure, development and other processes to electroplating areas. and size are locked, and then silver plating and post-processing are performed to achieve ultra-precise selective plating.

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Fully automatic roll-to-roll wide row high-density lead frame wheel plating type selective silver plating equipment

Fully automatic roll-to-roll wide row high-density lead frame wheel plating type selective silver plating equipment

It is jointly developed by our company and a famous Japanese lead frame manufacturing company. It is aimed at the problems of current multi-row (100mm) high-density IC, SOT, QFP and other lead frames in traditional production lines, such as low yield and poor thickness uniformity. Comprehensive technical upgrades.

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QFN roll-to-roll (roll-to-sheet/sheet-to-sheet) fully automatic development and etching equipment

QFN roll-to-roll (roll-to-sheet/sheet-to-sheet) fully automatic development and etching equipment

Designed using the world's most advanced flexible manufacturing concepts, it can switch between roll-type and sheet-type recycling methods according to customer's subsequent process requirements. It can realize a series of production processes of unwinding, developing, etching, peeling, drying and collecting of QFN, QFP and other high-end lead frame materials. The production process is energy-saving, environmentally friendly, efficient and high-quality.

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QFN/high-precision integrated circuit lead frame etching integrated production equipment

QFN/high-precision integrated circuit lead frame etching integrated production equipment

Retracting and unwinding method: strip to strip/roll to roll/roll to sheet
Applicable lead frame specifications: Maximum width 350mm
Production speed: 0.5-4m/min
Etching dimensional accuracy: ±0.015mm

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