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Disc mold
Used with disc-type selective plating equipment to achieve selective silver plating (spot plating, ring plating, strip plating) in the functional area of the IC lead frame
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Tank chain mold
Used with tank chain-type selective plating equipment, it can achieve selective silver plating (point plating, ring plating, strip plating) in the functional area of the IC lead frame.
Pressure plate mold
Used with pressure plate type selective plating equipment, it can achieve selective silver plating (spot plating, ring plating) in the functional area of high-density IC/QFN lead frames.