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Select silver plating equipment solution for wide row high density lead frame

Client: Japanese company

Requirements: SOT lead frame, roll material (each roll weighs up to 500KG), material width is 120mm, needs to be selectively electroplated with silver, the plating accuracy is up to , the plating layer is uniform and dense, and there is no side leakage.

Solution: Our company has customized a new roll-to-roll selective silver plating equipment according to the requirements of customer product electroplating production, which has the following characteristics:

1. The maximum width of the workpiece that can be processed by the equipment reaches 150mm;

2. The equipment uses the disc-type selective plating mold designed by our company. The plating accuracy can reach 0.1mm and there is no side leakage.

3. The conductive mechanism adopts a mercury roller conductive structure to adapt to the plating requirements of wide-width and multi-row lead frames;

4. A multi-level shielding mechanism is adopted to make the plating current of the wide lead frame in the equipment evenly distributed and the plating layer to be uniform and dense;

5. The electroplating solution automatic adding system has a high degree of automation.

6. The flow control system of cleaning water adopts multi-stage water washing, which is energy-saving and environmentally friendly.

7. The electroplating equipment control software independently designed by our company is simple to operate and maintain, and can remotely monitor production data.

8. Our company provides a full range of services to ensure smooth production for customers.

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QFN lead frame etching equipment solution

CustomerDomestic listed companies

Requirements: High-precision QFN lead frame, the etching process is full etching or half etching, roll material, rewinding method: roll type or sheet type

Plan: In response to customer product production requirements, our company has developed a new lead frame etching equipment using our latest technological achievements, which has the following characteristics:

1. It is developed and designed by our company's international R&D team, using the latest international semiconductor equipment technology and Manufacturing process.

2. Suitable for roll-to-roll or roll-to-roll production of high-precision and high-density lead frames such as QFN and QFP For automated etching production of wafers, the precision and depth of etching meet extremely strict technical requirements.

3. The processed lead frame width is up to 350mm, and the production speed is adjustable from 0.5 to 4 meters/minute.

4. Automated liquid medicine synthesis and addition system, the equipment has a high degree of automation.

5. The equipment control software independently developed by our company is easy to operate and can remotely monitor production data.

6. Automatic maintenance reminder, humanized design, easy equipment maintenance.

7. Our company provides a full range of services to ensure smooth production for customers.

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Precision selection of silver plating equipment solutions for chip QFN lead frames

Customer: Sino-foreign joint ventures

Requirements: For high-precision and high-density lead frames and sheets such as QFN and QFP, the precision of the silver-plated area is selected to be controlled at ±50?

Plan: In response to the requirements of customer product production, our company has developed a new lead frame silver plating equipment using our latest technological achievements and manufacturing processes, which has the following characteristics:

1. It is developed and designed by our company's international R&D team, using the latest international semiconductor equipment technology and Manufacturing process.

2. The equipment adopts high-precision positioning in the unwinding and rewinding mechanisms and the silver plating host The servo system and vacuum suction mechanical arm enable precise positioning and no deformation during the processes of grabbing, transferring, placing, and stacking the sheets, and there is no cumulative positioning error in electroplating production.

3. The 6 channels can be controlled individually, and one equipment can produce 6 types of lead frame products at the same time.

4. The silver-plated host uses a uniquely designed pressure box and a high-precision electroplating mold. The ultra-high-precision selective electroplating silver mechanism can realize ultra-micro regional electroplating, ensuring the accuracy, plating quality and plating efficiency of the electroplating area.

5. It is equipped with an advanced electroplating liquid automatic adding system, which can monitor the solution value and Based on these data, various chemical liquid components are automatically synthesized into electroplating solutions, and appropriate amounts are added to the working liquid storage tank.

6. The electroplating equipment control software independently developed by our company is easy to operate and can remotely monitor production data. .

7. Automatic maintenance reminder, humanized design, easy equipment maintenance.

8. Our company provides a full range of technical services and support to ensure the normal operation of customers' equipment and smooth production. .

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SMD bracket selective silver plating equipment solution

Customer: A large domestic LED bracket manufacturer and listed company

Requirements: Aiming at the selective silver plating production of various SMD stents, it has a high degree of automation, strong product versatility, high production efficiency, and saves liquid medicine.

Plan: In response to customer product production requirements, our company uses our latest technological achievements and manufacturing processes to design roll-to-roll LED high-speed selective silver plating equipment for customers. The equipment has the following characteristics:

1. Use our latest technological achievements And the manufacturing process adopts the roll-to-roll rewinding and unwinding method, and the equipment operation is stable and reliable.

2. The design of the silver-plated host uses my The company's multiple independent intellectual property rights can realize the functions of selective plating, full plating, selective plating and full plating on both sides of the front and back of the SMD bracket.

3. The equipment uses the round shape designed by our company Select the plate type electroplating mold, the electroplating accuracy can reach 0.1mm, and there is no side leakage.

4. The equipment has high production efficiency and is the fastest The running speed is 12 meters/minute.

5. Use people-oriented design concepts, and more A humanized design facilitates the operation and maintenance of the equipment.

6. Electroplating equipment independently developed by our company The control software is easy to operate and can realize remote monitoring of production data.

7. Our company provides a full range of technical services and support to ensure the normal operation of customers' equipment and smooth production.

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