Product details
Pressure plate mold
Category:
Electroplating mold series
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Product description
Mold usage: used with pressure plate type electroplating equipment , to achieve selective silver plating (point plating, ring plating) in the functional area of the high-density IC/QFN lead frame.
Chip pressure plate mold suitable products:
High-density QFN lead frame, plating types include Spot (point plating), Ring Plating (ring plating), Double Ring (double ring plating).
Stable batch production electroplating accuracy: ±0.075mm (ultimate accuracy±0.0635mm)
Product specifications: Film width 110mm (maximum) * Film length 300mm (maximum)
Material: High-density fiberglass (mold body): RTV silicone (gel particles)
Selection of plating accuracy: ±0.075mm
Applicable workpiece specifications: 100mm (maximum)*250mm (maximum)
Molds can be customized according to customers' lead frame products
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Telephone:0769-86857688
Marketing Department:0769-86857688-818
Mobile:13923798157 (Mr. Luo)
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Mailbox:yiq@szamt.com
Fax: 0769-86856766
Address: Allmerit Intelligent Industrial Park, No.2 Shaping Road, Keyuan City Information Industrial Park, Tangxia Town, Dongguan City -
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