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High-precision integrated circuit lead frame film removal equipment

Equipment usage: Pre-selective electroplating of silver on the surface before etching IC/QFN lead frame materials

Category:

Lead frame etching equipment series


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Product description

High-precision integrated circuit lead frame film removal equipment

Equipment purpose: Pre-selective plating of the surface before etching of IC/QFN lead frame materials Silver

Retracting and unwinding method: roll to roll

Operating channel: 1-2 channels

Production speed: 1-4m/min

Applicable lead frame specifications: material width 200-350mm

Accuracy:±0.02mm

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