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High-precision integrated circuit lead frame film removal equipment
Equipment usage: Pre-selective electroplating of silver on the surface before etching IC/QFN lead frame materials
Category:
Lead frame etching equipment series
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Product description
High-precision integrated circuit lead frame film removal equipment
Equipment purpose: Pre-selective plating of the surface before etching of IC/QFN lead frame materials Silver
Retracting and unwinding method: roll to roll
Operating channel: 1-2 channels
Production speed: 1-4m/min
Applicable lead frame specifications: material width 200-350mm
Accuracy:±0.02mm
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