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High-density integrated circuit lead frame electroplating before etching equipment series
Equipment usage: IC/QFN lead frame browning/roughening micro-etching treatment
Category:
Lead frame etching equipment series
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Product description
High-precision integrated circuit lead frame etching equipment
Retracting and unwinding method: sheet-to-sheet/roll-to-roll
Running channel: 1-2 channel
Production speed: 1-4m/min
Applicable lead frame specifications: material width 30-110mm
Roughened/corroded area: 75-85%
Roughness after etching: Max0.6um
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