图片名称

Product details


+
  • img482.png

High-density integrated circuit lead frame electroplating before etching equipment series

Equipment usage: IC/QFN lead frame browning/roughening micro-etching treatment

Category:

Lead frame etching equipment series


Contact us

Product description

High-precision integrated circuit lead frame etching equipment

Retracting and unwinding method: sheet-to-sheet/roll-to-roll

Running channel: 1-2 channel

Production speed: 1-4m/min

Applicable lead frame specifications: material width 30-110mm

Roughened/corroded area: 75-85%

Roughness after etching: Max0.6um

Submit
%{tishi_zhanwei}%