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Precision IC lead frame developing equipment
Equipment usage: QFN/high-precision integrated circuit lead frame etching integration changed to cleaning/development/film stripping integration
Category:
Lead frame etching equipment series
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Product description
Precision integrated circuit lead frame development equipment
Retracting and unwinding method: sheet-to-sheet/roll-to-roll/roll-to-sheet< /span>
Applicable lead frame specifications: maximum width 350mn
Production speed: 0.5-4m/min
Etching size accuracy: ±0.015mm
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