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Precision IC lead frame developing equipment

Equipment usage: QFN/high-precision integrated circuit lead frame etching integration changed to cleaning/development/film stripping integration

Category:

Lead frame etching equipment series


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Product description

Precision integrated circuit lead frame development equipment

Retracting and unwinding method: sheet-to-sheet/roll-to-roll/roll-to-sheet< /span>

Applicable lead frame specifications: maximum width 350mn

Production speed: 0.5-4m/min

Etching size accuracy: ±0.015mm

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