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Lead frame silver plating equipment series

Lead frame etching equipment series

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IC lead frame disc type selective silver plating equipment

Applicable lead frame specifications: material width 10-110mm;
material thickness: 0.08-1.02mm
Plating area control accuracy: ±0.075mm
Production speed: 3-12m/min
Operating channel: 2 channels

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Applicable lead frame specifications: material width 10-110mm; material thickness: 0.08-1.02mm

Plating area control accuracy: ±0.075mm

Production speed: 3-12m/min

Operating channel: 2 channels

QFN/high-precision integrated circuit lead frame etching integrated production equipment

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