IC lead frame Disk-Type selective plating equipment

The disk-type selective plating equipment is widely applicable to mass production of various IC lead frames and product types such as SOP, SSOP, TSSOP, SOT, SOM, DIP, PDIP, etc.

Basic Specifications of the Equipment:

1. It adopts a dual-channel operation mode with an adjustable speed ranging from 2 to 10m/min.

2. Electroplating base materials: Copper alloy, iron alloy.

3. Width of the electroplating strip: 25mm~110mm.

4. Thickness of the electroplating strip: 0.1mm~0.35mm (specific thickness requires detailed analysis).

5. Electroplating thickness of the plating layer (Ag): 10~400u’ (0.25μm~10μm). The specific thickness capability can also be specially designed and adjusted according to customer requirements.

Every component is the result of painstaking design efforts by Allmerite's engineering designers, who continuously optimize and upgrade them to achieve better electroplating effects and provide customers with superior product service quality.

The film receiving and releasing system features a dual-drive mechanism, with one in use and one as a backup, ensuring simple and safe operation. It also incorporates multi-level buffering and splice point alarms, allowing one operator to handle multiple machines. With patented design, high-precision linear guide rails are used as buffer tracks, ensuring high straightness. This system is easy to debug and provides more stable operation.

Water rinsing module: The water rinsing module is configured reasonably based on the process requirements to save water.

Multiple conductive structures are designed according to the requirements of product, structure, and process:

Graphite electrode: Graphite electrodes are suitable for small spaces and positions requiring low current. They are heat-resistant and do not generate arcs.

Mercury electrode: Conducting current in a liquid state, mercury electrodes require no other conductive medium, making them highly efficient. They also possess high accuracy and stability, long lifespan, strong abrasion resistance, and low torque.

Structural design of the chemical reaction tank: The silver tank uses a pulse rectifier, while the silver stripping tank employs an adjustable shielding structure on the edge of the plate to effectively control the tip effect, which can lead to higher plating on the edges and lower in the middle, thus improving the uniformity of the plating layer. Monitoring of the tank's liquid level effectively avoids the potential risk of no plating due to unstable pump flow. The nickel tank is designed with a constant temperature system to prevent temperature from exceeding the limit during summer due to the use of high-power rectifiers in the upper tank. The piping connections are layered, with automatic half-tank replacement for the acid tanks before and after. Precious metal tanks are designed with a visible liquid level indicator.

Design of electric control cabinet: the design of air-cooled electric box features good sealing performance and strong anti-corrosion ability, which greatly reduces maintenance costs. The electrical components adopt high-end brands such as Omron, Siemens, Panasonic, etc., with low failure rate and more stable equipment operation. The wiring is tidy and smooth, with clear markings, which is convenient for maintenance and repair.

Allmerite has always maintained concern and maintenance for customers and their equipment, and made improvements and upgrades to the equipment based on customer feedback. The high demands of high-end customers provide us with the greatest motivation for continuous improvement and enable us to maintain an absolute advantage in competition with our peers.

Based on the problem feedback from customers, we have promptly made systematic improvements and technological upgrades to the silver plating mainframe and selective plating molds.

Whether it is press-plate selective plating, tank chain selective plating, or disk selective plating, each electroplating mode has its own advantages, and the choice of equipment ultimately depends on the matching between the product and the electroplating mode. Therefore, in the selection of electroplating equipment, priority should be given to considering the type and characteristics of the product's electroplating, and then choosing the best-matched electroplating mode. Only in this way can we achieve long-term advantages in production efficiency and equipment stability.

Allmerite Technology adheres to the business philosophy of putting customers' needs at the heart of its operations, continuously innovating in research and design, and always insisting on using genuine materials and fine craftsmanship in production. With high-quality and high-efficiency production standards, we deliver products that best meet customer needs, greatly improving customers' production efficiency, achieving win-win cooperation between customers and suppliers, and jointly promoting the vigorous development of China's semiconductor electrochemical equipment industry.