Selective Electroplating

Selective electroplating refers to the localized plating of selected areas of a workpiece, which is achieved through controlled deep electroplating. This process involves fixing the component in a way that provides continuous electrical contact and immersing the area to be plated into a plating solution of a limited depth.

Selective electroplating is ideal for special applications, where precious metals are electroplated functionally to achieve performance and cost savings by reducing the required surface area of the plate. It also allows for selective coating prevention of certain components.

Given the complexity of selective electroplating and its high precision requirements, in order to better adapt to and complete the electroplating of lead frames, Allmerit Technology has developed three uniquely crafted selective silver plating equipment based on the characteristics of different lead frame specifications, aiming to fully satisfy customers' needs for products.

Next, Allmerit will take you on a journey to deeply understand its series of selective electroplating equipment for integrated circuit lead frames, to appreciate its extraordinary design philosophy. First, let's introduce Allmerit's press plate selective plating equipment for integrated circuit lead frames.

Press Plate Selective Plating Equipment for Integrated Circuit Lead Frames

The press plate selective plating equipment is suitable for high-precision plating processes such as ring plating and double ring plating for QFN, DFN (Package Size 2.5X2.5-12X12), as well as other types of high-density IC lead frames such as SOP, QFP, SOT, DIP, and so on.

It can accommodate products with a thickness of 0.1mm-0.5mm, a length of 170mm-300mm, and a width of 25mm-110mm.

The electroplating thickness can achieve an extremely small range of 0~1.0um (specifically influenced by the product structure and mold design).

This equipment boasts numerous advantages that other industry counterparts cannot match, with many original patented technologies being implemented for the first time both domestically and internationally:

The 4-channel staggered arrangement ensures that operations do not interfere with each other. The press plate selective plating equipment splits the four channels into two sides for operation, with the silver plating sections arranged in a staggered manner on one side and working independently. This design allows for convenient mold conversion without the need to stop other channels.

The silver plating section employs an internal cavity recirculation mode. This eliminates the risk of plating solution splashing and steam generation, thereby reducing the risk of precious metal splashing and leakage, and making the operation safer and more reliable.

For the entire silver plating section of the machine, all the frame materials are made of SUS316L with a thickness of 50-100mm, ensuring sufficient strength and easier cleaning. The enhanced structure of the silver plating section ensures stability during long-term operation of the equipment, reducing the risk of deformation under pressure.

The entire line features a tunnel-type operation structure. This design addresses the technical difficulties and inconvenience of operation adjustments for tunnel-type operation for the first time, avoiding issues such as scratches and contamination on the silver-plated surface caused by roller-type equipment from Japan and South Korea.

Operation Interface and Production Parameter Monitoring: The main operation page is hierarchically structured, making it simple and clear to operate. The control IO can display real-time status, with real-time monitoring of current, temperature, and speed.

Allmerit Technology always emphasizes "technological innovation" and "precision craftsmanship" in the research and design of its equipment. We are committed to solving common problems in industry equipment and comprehensively upgrading our products to give customers a more reassuring and smoother experience. Therefore, Allmerit's press plate selective plating equipment for integrated circuit lead frames has become the preferred choice for customers in the industry.

Stay tuned for our next article on the precision and complex tank chain selective plating equipment for integrated circuit lead frames!