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High-precision integrated circuit lead frame roll-to-roll plate-type silver plating equipment

Equipment usage: IC/TO-220 lead frame selective silver (spot plating)

Category:

Lead frame silver plating equipment series


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Product description

Equipment usage: IC/TO-220 lead frame Selective silver (spot plating)

Retracting and unwinding method: roll to roll

Electroplating positioning method: mechanical positioning/image recognition positioning

Operating channel: 2-6 channels

Production speed: 1-3m/min

Applicable lead frame specifications: material width 30-110mm

Electroplating accuracy:±0.065mm

Material thickness: Max2.03mm

 

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