Product details
High-density integrated circuit lead frame chip-to-chip pressing plate silver plating equipment
Category:
Lead frame silver plating equipment series
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Product description
Equipment usage: IC/TO-220 lead frame Selective silver plating (spot plating)
Retracting and unwinding method: piece to piece
Electroplating positioning method: mechanical positioning/image recognition positioning
Running channel: 2-6 channel
Production speed: 1-3m/min
Applicable lead frame specifications: material width 30-110mm
Electroplating accuracy:±0.05m
Material thickness: Max2.03mm
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Telephone:0769-86857688
Marketing Department:0769-86857688-818
Mobile:13923798157 (Mr. Luo)
Mailbox:lcf@szamt.com -
Mobile:13922878171 (Mr. Yan)
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Mailbox:yiq@szamt.com
Fax: 0769-86856766
Address: Allmerit Intelligent Industrial Park, No.2 Shaping Road, Keyuan City Information Industrial Park, Tangxia Town, Dongguan City -
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