图片名称

Product details


+
  • 20150417115756_41634.jpg

Chip QFN lead frame high speed plating equipment

This equipment was developed by our company's international R&D team using the latest international semiconductor equipment technology and manufacturing processes. For the selective silver plating production of various high-precision IC integrated circuit lead frames such as QFN and QFP, the accuracy of the electroplating selection area is controlled at ±50°, and the production data can be digitally monitored in real time and database managed. The equipment has fully reached the international advanced level in terms of technical parameters.

Category:

Product Center

Lead frame silver plating equipment series


Contact us

Product description

Chip QFN lead frame high speed plating equipment

1

This equipment was developed by our company's international R&D team using the latest international semiconductor equipment technology and manufacturing processes. For the selective silver plating production of various high-precision IC integrated circuit lead frames such as QFN and QFP, the accuracy of the electroplating selection area is controlled at ±50°, and the production data can be digitally monitored in real time and database managed. The equipment has fully reached the international advanced level in terms of technical parameters.

 

Prev

Next

Prev

Next

Submit
%{tishi_zhanwei}%