News
With the mission of "enhancing customer value with our products", Allmerit's fully automatic high-speed tin plating equipment is ready to go and write a gorgeous chapter for the semiconductor industry! #semiconductorequipment
10
2023
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07
SEMICON China will restart in 2023. After an absence of four years, we and everyone will gather again on the east side of the Pujiang River to explore the upward growth potential of the semiconductor industry and open up new ideas for development!
07
2023
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07
What are the basic principles of electroplating?
Electroplating is an electrochemical process and a redox process. The basic process of electroplating is to immerse the parts in a solution of metal salts as the cathode, and the metal plate as the anode. After connecting to a DC power supply, the required coating is deposited on the parts.
05
2023
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07
What is the function of QFN lead frame etching equipment?
At present, most of the QFN lead frames purchased by domestic QFN packaging and testing companies are from abroad. There are few domestic supporting facilities and a low degree of automation. The yield rate of QFN lead frames is not high. There is an urgent need for supporting lead frame factories in China.
05
2023
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07
What are the characteristics of chip QFN lead frame fully automatic plating equipment?
The high-density, high-leg-count, ultra-wide (120mm) chip QFN lead frame fully automatic electroplating equipment developed by our company has broken the monopoly of foreign companies in this field, filled the domestic gap, and fully reached international standards in terms of technical parameters. advanced level. The device is now on the market and has received high praise from customers. Its main features are:
05
2023
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07
In order to better conduct electronic electroplating technology exchanges and better demonstrate China's new electronic electroplating processes, new products, and new equipment; comprehensively summarize and display the technological progress in the field of electronic electroplating in my country over the past 35 years; introduce current domestic and foreign advanced electronic electroplating technologies and future development trends. The 2014 China Electronic Plating Expert Committee (35th Anniversary) Academic Annual Meeting will be held on December 1-2 at Kingkey Bay Hotel in Dameisha, Shenzhen. The organizer is Shenzhen Omet Technology Co., Ltd., and there will be more than 50 people Famous experts at home and abroad participated and gave reports.
05
2023
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07
On August 23, 2015, relevant engineering and technical personnel from domestic and foreign electronic plating and surface treatment research and production, experts and professors from universities and research institutes gathered at Shaanxi Normal University in Xi'an to participate in the China Electronic Plating Expert Committee Shenzhen Allmerit Technology Co., Ltd. was also invited to participate in the "2015 17th China Electronic Plating Experts Committee Academic Annual Conference" hosted by Shenzhen Allmerit Technology Co., Ltd., and made an academic report on the technical difficulties and solutions of tin plating for semiconductor packaging at the conference. .
05
2023
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07
Select silver plating equipment solution for wide row high density lead frame
Client: Japanese company
Requirements: SOT lead frame, roll material (each roll weighs up to 500KG), material width is 120mm, needs to be selectively electroplated with silver, the plating accuracy is up to , the plating layer is uniform and dense, and there is no side leakage.
Solution: Our company has customized a new roll-to-roll selective silver plating equipment according to the requirements of customer product electroplating production, which has the following characteristics:
1. The maximum width of the workpiece that can be processed by the equipment reaches 150mm;
2. The equipment uses the disc-type selective plating mold designed by our company. The plating accuracy can reach 0.1mm and there is no side leakage.
3. The conductive mechanism adopts a mercury roller conductive structure to adapt to the plating requirements of wide-width and multi-row lead frames;
4. A multi-level shielding mechanism is adopted to make the plating current of the wide lead frame in the equipment evenly distributed and the plating layer to be uniform and dense;
5. The electroplating solution automatic adding system has a high degree of automation.
6. The flow control system of cleaning water adopts multi-stage water washing, which is energy-saving and environmentally friendly.
7. The electroplating equipment control software independently designed by our company is simple to operate and maintain, and can remotely monitor production data.
8. Our company provides a full range of services to ensure smooth production for customers.
05
2023
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07