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What are the characteristics of chip QFN lead frame fully automatic plating equipment?
Release time:
2023-07-05 17:38
The high-density, high-leg-count, ultra-wide (120mm) chip QFN lead frame fully automatic electroplating equipment developed by our company has broken the monopoly of foreign companies in this field, filled the domestic gap, and fully reached international standards in terms of technical parameters. advanced level. The device is now on the market and has received high praise from customers. Its main features are:
1. The silver-plated host has no cumulative positioning error and can achieve ultra-high yield rates for QFN and high-density ICs that cannot be achieved on other roll-type electroplating equipment;
2. In the retracting and unloading and silver-plating host parts, the world's top-level high-precision servo system and Robostar robotic arm are used to achieve high-precision and seamless grabbing, transfer, positioning, placing and stacking of the pieces. Deformation and smoothness;
3. The silver plating host adopts a unique and innovative structure of pressure box and plating mold design and ultra-high precision processing, which effectively ensures the accuracy of the plating area, surface quality and plating efficiency;
4. The design and manufacture of efficient and precise transmission systems make the operation of the blanks more stable, accurate and reliable;
5. The high-rigidity mechanical structure design of the whole machine, the tank body using a large number of high-temperature-resistant imported HTPVC, and the carefully arranged parts processing and component assembly process ensure high precision, high stability and reliability during the long-term operation of the equipment.
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