On August 23, 2015, relevant engineering and technical personnel from domestic and foreign electronic plating and surface treatment research and production, experts and professors from universities and research institutes gathered at Shaanxi Normal University in Xi'an to participate in the China Electronic Plating Expert Committee Shenzhen Allmerit Technology Co., Ltd. was also invited to participate in the "2015 17th China Electronic Plating Experts Committee Academic Annual Conference" hosted by Shenzhen Allmerit Technology Co., Ltd., and made an academic report on the technical difficulties and solutions of tin plating for semiconductor packaging at the conference. .

This academic annual meeting was attended by many people from the industry, including Professor Li Ming from Shanghai Jiao Tong University, Professor An Maozhong from Harbin Institute of Technology, Global Executive President of Lesi Chemical Weislin, Director Shen Xiaoying of JCU Research Office, Professor Li Li from Chongqing University, and Professor Sun Jianjun from Fuzhou University. , Ningbo Kangqiang Senior Engineer Feng Xiaolong, Changzhou University Professor Chen Zhidong, Allmerit Technology Chairman Su Qian and PhD Supervisor Luan Shandong and other well-known experts and scholars in the industry discussed academic issues in the field of electronic plating. At the meeting, experts and scholars respectively proposed new developments in electrodeposition technology in three-dimensional packaging, the coordination of hydantoin and metal ions and its application in cyanide-free electroplating; high-quality nanometer surface treatment technology in electronic assembly; polymer Electroless plating technology of imide films; current research status of pulse composite electrodeposition; new progress in electroplating solution analysis methods; progress in high-density integrated circuit lead frame technology; low-temperature electroless nickel plating and electroless plating of soft nickel and semiconductors on the surface of flexible circuit boards Academic reports on the technical difficulties and solutions of packaging tin plating.

The annual academic conference came to a successful conclusion on August 24. The conference provided a communication and academic release platform for experts and scholars in the field at home and abroad in electronic electroplating process technology, electronic electroplating basic technology and electronic electroplating environmental protection technology. Through the experts’ thoughts and The academic collision is believed to play a positive role in promoting the development of China's future electronic plating technology.