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Allmerit integrated circuit lead frame press plate selective plating equipment and molds
In the early days of the development of IC lead frame plating, products were generally fully gold-plated. However, as the market demand for lead frame production increased, the relative cost was very high, making it difficult for many small and medium-sized companies to accept it. In the early 1970s, some companies began to use full silver plating technology instead of gold plating. In the late 1970s, some Japanese companies began to use partial silver plating, which is our current selective plating. Due to this method It can save the amount of precious metals, so it is widely used in the semiconductor material industry, developed rapidly, and continues to this day.
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2023
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Allmerit Technology's ingenuity is limited, and the hard work is infinite!
Allmerit Technology's ingenuity is limited, and the hard work is infinite!
07
2023
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Allmerit's tin plating equipment adopts precision technology to ensure accurate delivery and provide sincere service!
26
2023
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Allmerit Technology's high-density integrated circuit lead frame browning equipment leads the industry to new heights!
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2023
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