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Crossing the strait, embarking on a new journey | Allmerit's integrated circuit lead frame disc-type selective plating equipment is ready to set sail for Taiwan!
Release time:
2024-11-30 17:30
In the tide of global economic integration, Allmerit is committed to providing excellent products and services to global customers as a leading domestic equipment manufacturer. After years of exporting to overseas clients, following the successful delivery of tin-plating equipment for integrated circuit lead frames to a well-known semiconductor company in India, Allmerit's integrated circuit lead frame disc-type selective silver-plating equipment will also cross the strait to Taiwan.
After the initial research, design, and production, this custom-made disc-type selective silver-plating equipment for integrated circuit lead frames for the Taiwanese client has successfully passed the client's rigorous acceptance tests. This means that Allmerit's cooperation with the Taiwanese client has entered the final critical stage: disassembly, packaging, and shipping.
Allmerit's professional disassembly and packaging team developed a detailed disassembly and packaging plan based on the structural characteristics of the equipment, transportation requirements, and client feedback. Before disassembly, precise positioning and marking of each component of the equipment were carried out to ensure accurate identification and reinstallation during the disassembly process.
Based on the size, weight, and shape of the equipment, Allmerit designed and customized special wooden pallets for placing, isolating, and securing the equipment sections. During the packaging process, each component was placed in order according to the disassembly sequence. Professional straps and fixing devices were used to ensure the stability and safety of the equipment inside the packaging box. Additionally, sufficient shock-absorbing materials were added to absorb vibrations and impacts during transportation.
After the packaging was completed, clear labels were affixed to the packaging box, including the section numbers and names of the equipment, as well as protective markings for transportation.
Now, all packaging work has been successfully completed, with each segment of goods arranged in order and neatly placed, ready for loading and shipping. This Allmerit integrated circuit lead frame disc-type selective electroplating equipment will successfully enter the Taiwanese semiconductor market, bringing higher lead frame electroplating efficiency and good yield to clients, helping them stand out in fierce market competition.
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