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All things say goodbye to midsummer; beauty, set out for early autumn! Dongguan Allmerit wishes everyone a happy Beginning of Autumn!

All things say goodbye to midsummer; beauty, set out for early autumn! Dongguan Allmerit wishes everyone a happy Beginning of Autumn!

08

2023

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08

Another efficient completion of ST Morocco semiconductor tin plating equipment installation project

Another efficient completion of ST Morocco semiconductor tin plating equipment installation project

 

03

2023

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08

Pass on love and go to the future together, Allmerit Technology’s summer care event was held in full swing!

Allmerit Technology has a company code of choosing one thing for life and not focusing on prosperity. We hope to pass on this craftsmanship to the next generation. The company planned and held activities to care for employees' children during the summer vacation.

 

21

2023

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07

Allmerit Technology plastic packaging integrated circuit lead frame high-speed electro-tin plating equipment, set off today!

With the mission of "enhancing customer value with our products", Allmerit's fully automatic high-speed tin plating equipment is ready to go and write a gorgeous chapter for the semiconductor industry! #semiconductorequipment

10

2023

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07

Warmly celebrate the successful conclusion of Dongguan Allmerit Technology's 2023 Shanghai SEMI exhibition

SEMICON China will restart in 2023. After an absence of four years, we and everyone will gather again on the east side of the Pujiang River to explore the upward growth potential of the semiconductor industry and open up new ideas for development!

07

2023

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07

What are the basic principles of electroplating?

Electroplating is an electrochemical process and a redox process. The basic process of electroplating is to immerse the parts in a solution of metal salts as the cathode, and the metal plate as the anode. After connecting to a DC power supply, the required coating is deposited on the parts.

05

2023

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07

What is the function of QFN lead frame etching equipment?

At present, most of the QFN lead frames purchased by domestic QFN packaging and testing companies are from abroad. There are few domestic supporting facilities and a low degree of automation. The yield rate of QFN lead frames is not high. There is an urgent need for supporting lead frame factories in China.

05

2023

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07

What are the characteristics of chip QFN lead frame fully automatic plating equipment?

The high-density, high-leg-count, ultra-wide (120mm) chip QFN lead frame fully automatic electroplating equipment developed by our company has broken the monopoly of foreign companies in this field, filled the domestic gap, and fully reached international standards in terms of technical parameters. advanced level. The device is now on the market and has received high praise from customers. Its main features are:

05

2023

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07

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